If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last ...

Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build ...

In November 2023, Apple signed a deal with Amkor to package its Apple Silicon at the Peoria facility, which TSMC will produce ...

“Amkor is proud to collaborate with TSMC to provide seamless integration of silicon manufacturing and packaging processes ...

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and ...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add ...

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as ...

Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and testing deal with ...

Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American ...

TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test ...