Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build ...

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as ...

Amkor Technology Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed an agreement to bring advanced packaging and test capabilities to the pure play foundry’s Arizona fabs currently ...

Taiwanese contract chipmaker TSMC has partnered with Arizona-based Amkor Technology to bring advanced chip packaging and ...

In November 2023, Apple signed a deal with Amkor to package its Apple Silicon at the Peoria facility, which TSMC will produce ...

Recent collaborations with Amkor Technology in Arizona aim to enhance semiconductor packaging capabilities and speed up ...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

Amkor Technology and TSMC announced the signing of a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona, further expanding the region’s semiconductor ...

Taiwan Semiconductor's robust AI-related growth supports high revenue growth and premium valuation multiples. Read why I rate ...

Apple’s chip-making partner TSMC and chip packaging company Amkor announced on Thursday that they’ve agreed in principle to ...

If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last ...