Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build ...

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as ...

Amkor Technology Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed an agreement to bring advanced packaging and test capabilities to the pure play foundry’s Arizona fabs currently ...

Sources say AMD will use TSMC's new Arizona fab for the production of new HPC AI chips on the 5nm mode. This move begins an ...