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TSMC, Arizona and Amkor
Apple, Amkor, and TSMC ‘neath the Arizona Skies
If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last November. This made Apple the “first and largest” customer at Amkor’s new manufacturing plant, which at that time was billed as the “largest advanced packaging facility in the US.”
Amkor inks deal with TSMC for provision of packaging and test services in Arizona
In November 2023, Apple signed a deal with Amkor to package its Apple Silicon at the Peoria facility, which TSMC will produce at its nearby Phoenix fab. As a result of the deal, Apple became the “first and largest” customer at Amkor’s new plant.
Advanced packaging and test come to TSMC’s Arizona fabs
Amkor Technology Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed an agreement to bring advanced packaging and test capabilities to the pure play foundry’s Arizona fabs currently under construction.
Amkor and TSMC to expand partnership in Arizona
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications.
Apple Chip Manufacturing in U.S. to Expand Following New Partnership
Apple's chip manufacturer TSMC and chip packaging company Amkor on Thursday announced that the two companies have signed a memorandum
TSMC-Amkor chip packaging deal will boost Apple chip production in the US
TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.
TSMC and Amkor link up to bring advanced packaging stateside
Arizona looks like the place to be for US semiconductor manufacturing Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American
TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona.
ExtremeTech on MSN
10h
Report: AMD to Buy AI Chips From TSMC's New Arizona Fab
It was reported last month that TSMC's new fab in Arizona had begun cranking out 5nm chips for Apple. Now, it is being ...
6h
Homebuilder eyes 6,000 acres south of TSMC for master-planned project
The site is directly south of Loop 303, where TSMC is under construction on its $65 billion fabrication facility.
Hosted on MSN
1d
AMD to reportedly become TSMC's next major customer in Arizona — HPC AI chips could start US production in 2025
Sources say AMD will use TSMC's new Arizona fab for the production of new HPC AI chips on the 5nm mode. This move begins an ...
TweakTown
18h
AMD should be TSMC's next huge customer for Arizona: HPC AI chips made in the USA in 2025
AMD is reportedly set to make its next-gen, high-perf chips at TSMC's new fab in Arizona, making it the second big client for ...
1d
How TSMC-affiliated families from Taiwan are adjusting to life in metro Phoenix
Moving from Taiwain to Arizona for TSMC jobs has meant big cultural adjustments. Here's how families are coping and what it ...
8d
TSMC Arizona president retires, successor named
The website you are visiting is protected and accelerated by Incapsula. Your computer may have been infected by malware and ...
8d
Diary of the deal: Years of courtship, pivotal helicopter ride brought TSMC to Phoenix
What led industry leader TSMC to choose Arizona? Phoenix and state economic officials worked hard for a deal long before the ...
11h
Hundreds of children of TSMC workers from Taiwan have enrolled in Deer Valley schools
The Deer Valley Unified School District has already received hundreds of new students from Taiwan tied to TSMC plant and more are coming.
Digi Times
1d
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...
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AMD
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