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TSMC, Amkor and Arizona
Amkor inks deal with TSMC for provision of packaging and test services in Arizona
In November 2023, Apple signed a deal with Amkor to package its Apple Silicon at the Peoria facility, which TSMC will produce at its nearby Phoenix fab. As a result of the deal, Apple became the “first and largest” customer at Amkor’s new plant.
TSMC-Amkor chip packaging deal will boost Apple chip production in the US
TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.
Apple, Amkor, and TSMC ‘neath the Arizona Skies
If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last November. This made Apple the “first and largest” customer at Amkor’s new manufacturing plant, which at that time was billed as the “largest advanced packaging facility in the US.”
TSMC and Amkor link up to bring advanced packaging stateside
Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American soil. The Memorandum of Understanding marks another step in bolstering the US chip supply chain and the country's standing in the global market – a key objective supported by the CHIPS Act.
Amid AI Frenzy, TSMC Brings Advanced Chip Packaging To US For The First Time
Taiwanese contract chipmaker TSMC has partnered with Arizona-based Amkor Technology to bring advanced chip packaging and testing capabilities to the United States (US) for the first time.
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications.
Amkor and TSMC to expand partnership in Arizona
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications.
Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUs
Amkor and TSMC on Friday said they had signed a memorandum of understanding to bring TSMC’s proven advanced packaging technologies — chip-on-wafer-on-substrate (CoWoS) and int
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services,
Apple Chip Manufacturing in U.S. to Expand Following New Partnership
Apple's chip manufacturer TSMC and chip packaging company Amkor on Thursday announced that the two companies have signed a memorandum
TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona.
Digi Times
1d
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...
Hosted on MSN
1d
AMD to reportedly become TSMC's next major customer in Arizona — HPC AI chips could start US production in 2025
Sources say AMD will use TSMC's new Arizona fab for the production of new HPC AI chips on the 5nm mode. This move begins an ...
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